Safeguard your flagship computer hardware and optimize core component heat transfer with the high-performance Cooler Master Thermal Pad Pro 1.0mm (Model: TPY-NDPB-9010-R1). Specially engineered for laptop repair technicians, graphic card refurbishers, extreme overclockers, and custom PC builders across Myanmar, this enthusiast-grade thermal interface material effectively closes gaps between hot electronic components and your system's copper heatsinks. Delivering an ultra-high 15.3 W/mK thermal conductivity rating, it helps sustain safe operating temperatures under continuous heavy workloads. Whether you are performing a maintenance service on a workstation laptop in Yangon or replacing worn-out factory memory pads on a crypto-mining rig in Mandalay, this 1.0mm pad delivers reliable, professional-grade thermal performance.
Key Features & Next-Gen Thermal Engineering
Enthusiast-Grade 15.3 W/mK Thermal Conductivity
Keep high-performance hardware running cool under intense stress. Formulated with advanced nano-zinc and silicon chemical compounds, this pad achieves a remarkable 15.3 W/mK conductivity rating. It quickly draws heat away from hot microchips out to cooling paths, preventing thermal throttling on graphics memory and power delivery circuits.
Complete Non-Electrical Conductivity for Structural Safety
Work on sensitive electronic components with confidence. The Thermal Pad Pro is carefully formulated to be **100% non-electrical conductive and non-capacitive**. It contains completely metal-free chemical structures, meaning there is zero risk of sudden electrical short-circuits or permanent hardware damage if it contacts exposed motherboard components or micro-capacitors.
Perfect 1.0mm Profile with Malleable Compressibility
Achieve clean mechanical contact across varied components. This 1.0mm variant offers a flexible structural design that compresses smoothly under standard heatsink mounting pressure. It fills subtle microstructures and uneven gaps perfectly, ensuring efficient thermal transfer without putting undue mechanical strain on delicate component solder points.
Universal Cut-to-Size Application Blueprint Layout
Ultimate versatility comes standard. Shipped in a clean **95 x 45 mm dimension sheet**, the pad features a clear spatial layout that can be sliced effortlessly with standard scissors or precise hobby knives. Easily shape custom-fit thermal strips for graphics card VRAM chips, high-speed M.2 NVMe solid-state drives, regulatory VRMs, power stages, and single-board electronics modules.
Resilient, Long-Lasting Construction for Changing Climates
Engineered to handle extreme operational environments throughout Myanmar's changing seasonal temperatures. The specialized compound resists chemical breakdown, fluid bleeding, and drying out over long-term use. Operating safely between temperatures of -40°C and 200°C, it remains fully pliable over years of continuous structural heat exposure.
Technical Specifications
| Hardware Parameter | Official Specifications |
|---|---|
| Product Name | Cooler Master Thermal Pad Pro 1.0mm |
| Model Number | TPY-NDPB-9010-R1 |
| Thermal Conductivity Rating | 15.3 W/mK (Enthusiast & Professional Repair Grade) |
| Pad Thickness Dimension | 1.0 mm ± 0.1mm Precision Tolerance Limit |
| Total Sheet Scale (L x W) | 95 x 45 mm (3.74 x 1.77 inches) |
| Electrical Conductivity | Non-Conductive / 100% Dielectric Insulation Safety |
| Specific Gravity Compound Density | 3.4 ± 0.2 g/cm³ |
| Hardness Structural Value | 30 - 60 Sc (Compression Hardness Index) |
| Safe Operational Temperature Limit | -40°C up to 200°C Reliable Operating Bounds |
| Primary Component Base | Advanced Silicone Matrix Infused with Nano-Thermal Zinc Oxides |
THERMAL PAD
Cooler Master's new Thermal Pad is an innovative solution to device cooling for a vast range of your electronic devices and components
FORMULATED WITH NANO ELEMENTS
13.3w/mK thermal conductivity for rapid cooling, capable of drawing high levels of heat.
NON-TOXIC AND NON-CORROSIVE
Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening.
DOUBLE-SIDED ADHESIVE
Provides seamless and secure contact between surfaces.
WIDE RANGE OF APPLICATION
Electronic devices, motherboards, components (CPU, GPU, USICS, Hard Drives, Disk Drives, IGBT module), laptops and various products requiring cooling.
